Autori: Fleshman Collin
| Naslov | The fractal nature analysis by applying grain formations of SAC305/OSP Cu and SAC305-0.05Ni/OSP Cu solder joints for microelectronic packaging (Article) |
| Autori | Mitic Vojislav V Fleshman Collin Duh Jenq-Gong Ilic Ivana D Lazovic Goran M |
| Info | MODERN PHYSICS LETTERS B, (2021), vol. 35 br. 33, str. - |
| Ispravka | ISI/Web of Science Članak Elečas Rang časopisa Citati: ISI/Web of Science Scopus |
