@ARTICLE{
author={Mitic Vojislav V,Fleshman Collin,Duh Jenq-Gong,Ilic Ivana D,Lazovic Goran M},
year={2021},
title={The fractal nature analysis by applying grain formations of SAC305/OSP Cu and SAC305-0.05Ni/OSP Cu solder joints for microelectronic packaging},
journal={MODERN PHYSICS LETTERS B},
volume={35},
number={33},
pages={-},
document_type={Article},
}